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Effect of Process Parameters on Organic Micro Patterns Fabricated on a Flexible Substrate Using the Near-Field Electrohydrodynamic Direct-Writing Method

Jianzhou Chen, Ting Wu, Libing Zhang and 3 more

Micromachines · 2019

doi:10.3390/mi10050287 (opens in a new tab)

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Abstract

A micro pattern is a key component of various functional devices. In the present study, using the poly(3,4-ethylenedioxythiophene):poly(styrenesulfonate) (PEDOT:PSS) mixed material as the direct-writing solution and photographic paper as the flexible insulating substrate, the organic micro patterns of various shapes, such as the curve of the second-order self-similar structure, the helical curve, and the wave curve, were fabricated on the flexible insulating substrate by using the near-field electrohydrodynamic direct-writing method. The effects of process parameters, such as the applied voltage, direct-writing height, flow rate of the injection system, and moving velocity of the substrate, on the width and the conductivity of the organic micro patterns were studied in the near-field electrohydrodynamic direct-writing process. The results show that the width of an organic micro pattern increases with the increase of the applied voltage of the high-voltage power supplier and the flow rate of the injection system under the condition where the three other process parameters remained constant, respectively, while the width of an organic micro pattern decreases with the increase of the direct-writing height and the moving velocity of the flexible substrate, respectively. The fabricated organic microcircuit patterns of the natural drying in air at room temperature were tested by a thin film thermoelectric tester at a detection temperature. The results show that the conductivity of a fabricated organic micro pattern decreases with the increase of the electric field intensity, while the effect of moving velocity and the flow rate on the conductivity is small under the condition where the three other process parameters remained constant.

Abstract licence: CC BY

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