Mechanical Modelling of Integration and Debonding Process of Ultra-Thin Inorganic Chips

The research on ultra-thin inorganic chips is an important field in the development of inorganic flexible electronics. By thinning the inorganic (mainly silicon-based) chip to less than 50 μm, it will gain a certain degree of flexibility. After the ultra-thin chip is integrated into the flexible substrate, it is bent repeatedly during the operation of the system. When the bending angle is excessively large, the chip and substrate will debond, or the chip will break. In this process, whether the chip can be stably adhered to the substrate depends on many factors, and debonding can only be reduced by continuously adjusting the process parameters. From an energy method perspective, this study divides the bending process of flexible silicon-based chips and flexible films into two states: debonding and non-debonding. A debonding mechanical model of flexible chips is established, and the regulatory relationship between the adhesion coefficient between the chip and film, chip geometric size, and material parameters was established. Experiments were also conducted to verify the relevant theoretical results. The theoretical results show that the risk of chip debonding decreases with a reduction in chip thickness, an increase in interface adhesion, and an increase in bending radius. Improving the interface adhesion during the bending process can effectively stabilize the adhesion of flexible chips. This paper provides a theoretical basis for the integration and bending of ultra-thin flexible chips and flexible substrates, promoting the practical assembly and application of ultra-thin chips.

Abstract licence: CC BY

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