Evaluation of Cu nano particles addition on the vertical density profile and mechanical properties of medium density fiberboard (MDF)

This study was conducted to investigate the effect of Cu nano particles addition on the density profile and mechanical properties of medium density fiberboard. One layer fiberboard (MDF) with the density of 0.58g/cm3and thickness of 17 mm were produced using Cu nano particles in three levels (5, 10 and 15wt%based on solid content of resin) and urea formaldehyde resin content in two levels (8 and 10wt%based on oven dry weight of fibers) as variable factors. The control panels were produced using 10% resin (based on oven dry weight of fibers) without Cu nano particles using the identical manufacturing parameters as other panels. Mechanical strength including internal bonding (lB), bending strength, modulus of elasticity and density profile using slicing method were determined. The results indicated that increasing the content of Cu nano-particles had no significant effect on the internal bonding as well as bending strength and modulus of elasticity of panels. Increasing the resin content from 8 to 10 percent improved modulus of elasticity (43.7%), bending strength (18.9%) and internal bonding (23%) of panels. In addition, the increasing Cu nano particles up to 5% caused relatively higher IB for panels produced using 8%resin compared to the control panels(containing10% resin) as well as the density profile was more uniform with the lowest differences between maximum and minimum density in the density profile.

Abstract licence: CC BY

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