Joining of Si3N4 to Si3N4 with Partially Crystallized Cordierite Glass or Oxynitride Glass Solders

Crystallization heat treatment was applied to the joint of silicon nitrides with a cordierite glass containing Zr0 2 , in order to improve the toughness of a joint.The crystallization depended on the layer thickness of the joint and did not occur when the thin layer was less than 30 μιη.Although crystallization resulted in the strengthening of the joint, the highest bending strength was obtained when the joint had a thickness of less than 30 μιη.Several oxynitride glass solders were then prepared and some properties, such as thermal expansion coefficient, Vickers hardness, glass transition temperature and their wettability with Si 3 N 4 were measured.Joining of Si 3 N 4 to Si 3 N 4 was carried out at a temperature between 1573 and 1873 Κ with oxynitride glass solders.The best joint was achieved for the condition in which the solder glass penetrated slightly into the Si 3 N 4 matrix and the resulting dissolution of the matrix produced a rough joined interface.A maximum bending strength of 400 MPa was obtained.This value corresponds to 73% of that for Si 3 N 4 matrix and was maintained up to 1073 K.

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