Modelling Thermal Resistance of Power Modules Having Solder Voids With Finite Elements
R. A. Tatara
Active and Passive Electronic Components · 1987
doi:10.1155/1987/19025 (opens in a new tab)
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Abstract
A general thermal model to calculate the thermal resistance of a power module having rectangular die and layers has been constructed. The model incorporates a finite element computer program to solve for three-dimensional heat conduction. Effects of voids in the solder regions are included. A sample case is analyzed, and a comparison is made to a recent study.
Abstract licence: CC BY
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