Low-energy mass-selected ion beam deposition of silicon carbide with Bernas-type ion source using methylsilane
Satoru Yoshimura, Satoshi Sugimoto, Takae Takeuchi and 2 more
AIP Advances · 2019
doi:10.1063/1.5116614 (opens in a new tab)
We email you when a new notice or a question about this paper appears.
Abstract
Methylsilane-derived fragment ions obtained from a Bernas-type ion source were investigated using a low-energy mass-selected ion beam system. Based on mass-energy analyzer measurements, these ions were determined to be H+, H2+, H3+, CH3+, Si+, and SiCH5+. The SiCH5+ ions were selected and injected into a Si(111) substrate at 750 °C. The ion energy was 40 eV. This injection led to the formation of a silicon carbide film on the Si substrate. An analysis of this film indicates that this type of ion beam deposition method can efficiently form silicon carbide film.
Abstract licence: CC BY
Reads
Read by people on this page
None yet.
Checked or read by AI through naulon
None yet.
A person counts once a day per paper. We keep no cookie and no address: a reader is a hash that changes every day. Any month under five reads shows no number.
Are you an author?
Is this your paper?
Claim it to add your note and be paid when agents cite it. Free.