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Large-area integration of two-dimensional materials and their heterostructures by wafer bonding
Arne Quellmalz, Xiaojing Wang, Simon Sawallich and 13 more
Nature Communications · 2021
doi:10.1038/s41467-021-21136-0
Cited by papers we hold 1
- 2D materials for future heterogeneous electronics · 2022No notice
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