Nanoscale evolution of interface morphology during electrodeposition
Nicholas M. Schneider, Jeung Hun Park, Joseph M. Grogan and 3 more
Nature Communications · 2017
doi:10.1038/s41467-017-02364-9 (opens in a new tab)
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Abstract
Understanding structure evolution during electrochemical growth is crucial in materials processing and design of devices such as batteries. Here, the authors image copper during electrodeposition to provide strategies for controlling interface morphology.
Abstract licence: CC BY-NC-ND
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