Synergistic enhancement of heat transfer between irregular shaped particles and boron nitride flakes at low loading

Thermal interface materials are the important development direction for solving heat transfer in microelectronics industry. Moreover, synergic effect is an important means to improve thermal conductivity of thermal interface materials. In this work, synergistic enhancement of heat transfer between irregular shaped particles and boron nitride flakes at low loading (5 wt%–30 wt%) are investigated, which includes irregular shaped MgO, Ag, Cu and CuO. The results show that the thermal conductivity of composites increase by filling with a small amount of boron nitride (1 wt% or 2 wt%). Furthermore, when the composite filled with 3 wt% Ag and 2 wt% BN, the thermal conductivity increased by 40%. In addition, besides the intrinsic thermal conductivity of additives, the geometrical characteristics of fillers and the thermal contact resistance between fillers and matrix are also key factors affecting the thermal transport properties of composites. Keywords: Irregular shaped particles, Boron nitride flakes, Thermal conductivity, Synergistic enhancement

Abstract licence: CC BY-NC

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