Device for in-situ cleaving of hard crystals
M. Schmid, A. Renner, F. J. Giessibl
Rev. Sci. Instr. 77, 036101 (2006) · 2005
We email you when a new notice or a question about this paper appears.
Abstract
Cleaving crystals in a vacuum chamber is a simple method for obtaining atomically flat and clean surfaces for materials that have a preferential cleaving plane. Most in-situ cleavers use parallel cutting edges that are applied from two sides on the sample. We found in ambient experiments that diagonal cutting pliers, where the cleavage force is introduced in a single point instead of a line work very well also for hard materials. Here, we incorporate the diagonal cutting plier principle in a design compatible with ultra-high vacuum requirements. We show optical microscopy (mm scale) and atomic force microscopy (atomic scale) images of NiO(001) surfaces cleaved with this device.
Abstract licence: CC0
Reads
Read by people on this page
None yet.
Checked or read by AI through naulon
None yet.
A person counts once a day per paper. We keep no cookie and no address: a reader is a hash that changes every day. Any month under five reads shows no number.
Are you an author?
Is this your paper?
Claim it to add your note and be paid when agents cite it. Free.